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bm6103fv-c product structure silicon integrated circuit this product is not designed protection against radioactive rays . 1/31 tsz02201-0717abh00010-1-2 ? 2012 rohm co., ltd. all rights reserved. 29.aug.2012 rev.004 tsz22111 ? 14 ? 001 www.rohm.com datashee t gate driver providing galvanic isolation series isolation voltage 2500vrms 1ch gate driver providing galvanic isolation bm6103fv-c general description the bm6103fv-c is a gate driver with isolation voltage 2500vrms, i/o delay time of 350ns, and minimum input pulse width of 180ns, and incorporates the fault signal output functions, undervoltage lockout (uvlo) function, thermal protection function, an d short current protection (scp, desat) function. features ? providing galvanic isolation ? active miller clamping ? fault signal output function (adjustable output holding time) ? undervoltage lockout function ? thermal protection function ? short current protection function (adjustable reset time) ? soft turn-off function for short current protection (adjustable turn-off time) ? supporting negative vee2 key specifications ? isolation voltage: 2500vrms ? maximum gate drive voltage: 24v ? i/o delay time: 350ns(max.) ? minimum input pulse width: 180ns(max.) package w(typ.) x d(typ.) x h(max.) ssop-b20w 6.50mm x 8.10mm x 2.01mm applications automotive isolated igbt/mosfet inverter gate drive automotive dc-dc converter industrial inverters system ups system typical application circuits r flt rls c flt rls out1 vtsin input side chip nc gnd1 gnd1 ina timer timer uvlo fltrls vcc1 output side chip test vee2 mask vreg out2 flt vcc2 logic s r q proout vee2 pre driver mask mask mask fb c vcc1 c vcc2 flt ena ecu inb gnd2 mask logic mask flt temp se nsor uvlo scpin vee2 figure 1. for using 4-pin igbt (for using scp function) r flt rls c flt rls out1 vtsin input side chip nc gnd1 gnd1 ina timer timer uvlo fltrls vcc1 output side chip test vee2 mask vreg out2 flt vcc2 logic s r q proout vee2 pre driver mask mask mask fb c vcc1 c vcc2 flt ena ecu inb gnd2 mask logic mask flt temp se nsor uvlo scpin vee2 figure 2. for using 3-pin igbt (for using desat function)
2/31 datasheet d a t a s h e e t bm6103fv-c tsz02201-0717abh00010-1-2 ? 2012 rohm co., ltd. all rights reserved. 29.aug.2012 rev.004 www.rohm.com tsz22111 ? 15 ? 001 recommended range of external constants pin name symbol recommended value unit min. typ. max. fltrls c fltrls - 0.01 0.47 uf r fltrls 50 200 1000 k vreg c vreg 1.0 3.3 10.0 uf vcc1 c vcc1 0.1 1.0 - uf vcc2 c vcc2 0.33 - - uf pin configuration pin description pin no. pin name function 1 vtsin thermal detection pin 2 vee2 output-side negative power supply pin 3 gnd2 output-side ground pin 4 scpin short current detection pin 5 out2 mos fet control pin for miller clamp 6 vreg power supply pin for driving mos fet for miller clamp 7 vcc2 output-side positive power supply pin 8 out1 output pin 9 vee2 output-side negative power supply pin 10 proout soft turn-off pin 11 gnd1 input-side ground pin 12 nc no connect 13 inb invert / non-invert selection pin 14 fltrls fault output holding time setting pin 15 vcc1 input-side power supply pin 16 flt fault output pin 17 ina control input pin 18 ena input enabling signal input pin 19 test test mode setting pin 20 gnd1 input-side ground pin figure 3. pin configuration ssop-b20w (top view)
3/31 datasheet d a t a s h e e t bm6103fv-c tsz02201-0717abh00010-1-2 ? 2012 rohm co., ltd. all rights reserved. 29.aug.2012 rev.004 www.rohm.com tsz22111 ? 15 ? 001 description of pins and cautions on layout of board 1) vcc1 (input-side power supply pin) the vcc1 pin is a power supply pin on the input side. to suppress voltage fluctuations due to the current to drive internal transformers, connect a bypass capacitor between the vcc1 and the gnd1 pins. 2) gnd1 (input-side ground pin) the gnd1 pin is a ground pin on the input side. 3) vcc2 (output-side positive power supply pin) the vcc2 pin is a positive power supply pin on the output side. to reduce voltage fluctuations due to out1 pin output current and due to the current to drive internal trans formers, connect a bypass capacitor between the vcc2 and the gnd2 pins. 4) vee2 (output-side negative power supply pin) the vee2 pin is a power supply pin on the output side. to s uppress voltage fluctuations due to out1 pin output current and due to the current to drive internal transformers, c onnect a bypass capacitor between the vee2 and the gnd2 pins. to use no negative power supply, connect the vee2 pin to the gnd2 pin. 5) gnd2 (output-side ground pin) the gnd2 pin is a ground pin on the out put side. connect the gnd2 pin to the emitter / source of a power device. 6) in (control input terminal) the in pin is a pin used to determine output logic. ena inb ina out1 h x x l l l l l l l h h l h l h l h h l 7) flt (fault output pin) the flt pin is an open drain pin used to output a fault signa l when a fault occurs (i.e., when the undervoltage lockout function (uvlo), short current protection function (scp ) or thermal protection function is activated). this pin is i/o pin and if l voltage is externally input, the output is set to l status regardless of other input logic. consequently, be sure to connect the pull-up resistor betw een vcc1 pin and the flt pin even if this pin is not used. pin flt while in normal operation hi-z when an fault occurs (when uvlo, scp or thermal protection is activated) l 8) fltrls (fault output holding time setting pin) the fltrls pin is a pin used to make setting of time to hold a fault signal. connect a capacitor between the fltrls pin and the gnd1 pin, and a resistor between it and the vcc1 pin. the fault signal is held until the fltrls pin voltage exceeds a voltage set with the v fltrls parameter. to set holding time to 0 ms, do not connect the capacito r. short-circuiting the fltrls pin to t he vcc1 pin will cause a high current to flow in the fltrls pin and, in an open state, may cause the ic to malfunction. to avoid such trouble, be sure to connect a resistor between the fltrls and the vcc1 pins. 9) out1 (output pin) the out1 pin is a pin used to drive the gate of a power device. 10) out2 (mos fet control pin for miller clamp) the out2 pin is a pin for controlling the external mos switch for preventing increase in gate voltage due to the miller current of the power device connected to out1 pin. 11) vreg (power supply pin for driving mos fet for miller clamp) the vreg pin is a power supply pin for driving mos fet for miller clamp. be sure to connect a capacitor between vreg pin and vee2 pin for preventing the oscillation and to r educe voltage fluctuations due to out2 pin output current. 12) proout (soft turn-off pin) the proout pin is a pin used to put the soft turn-off func tion of a power devise in operation when the scp function is activated. this pin combines with the gate voltage monitoring pin for miller clamp. 13) scpin (short current detection pin) the scpin pin is a pin used to detect current for short current protection. when the scpin pin voltage exceeds a voltage set with the v scdet parameter, the scp function will be activated. this may cause the ic to malfunction in an open state. to avoid such trouble, short- circuit the scpin pin to the gnd2 pin if the short current protection is not used. in order to prevent the wrong detection due to noise, the noise mask time t scpmsk is set.
4/31 datasheet d a t a s h e e t bm6103fv-c tsz02201-0717abh00010-1-2 ? 2012 rohm co., ltd. all rights reserved. 29.aug.2012 rev.004 www.rohm.com tsz22111 ? 15 ? 001 14) vtsin (thermal detection pin) the vtsin pin is a temperature sensor voltage input pin, which can be used for thermal protection of an output device. if vtsin pin voltage becomes v tsdet or less, out pin is set to l. in the open status, the ic may malfunction, so be sure to supply the vtspin more than v tsdet if the thermal protection function is not used. in order to prevent the wrong detection due to noise, the noise mask time t tsmsk is set. description of functions and examples of constant setting 1) miller clamp function when out1=l and proout pin voltage < v out2on , h is output from out2 pin and the external mos switch is turned on. when out1=h, l is output from out2 pin and the exter nal mos switch is turned off. while the short-circuit protection function is activated, l is output from out2 pin and the external mos switch is turned off. - + logic predriv er predriv er predriv er vcc2 out1 proout gnd2 vee2 v out2on predriv er predriv er out2 regulator vreg - + - + logic predriv er predriv er predriv er proout gnd2 vee2 predriv er predriv er out2 regulator vreg - + - + logic predriv er predriv er predriv er proout gnd2 vee2 predriv er predriv er out2 regulator vreg - + - + logic predriv er predriv er predriv er proout gnd2 vee2 predriv er predriv er out2 regulator vreg short current scpin in proout out2 detected not less than v scdet x x l not detected x l not less than v out2on hi-z x l not more than v out2on h x h x l figure 4. block diagram of miller clamp function figure 5. timing chart of miller clamp function v out2on in out1 proout (monitor the gate voltage) out2 t poff t pon t out2on
5/31 datasheet d a t a s h e e t bm6103fv-c tsz02201-0717abh00010-1-2 ? 2012 rohm co., ltd. all rights reserved. 29.aug.2012 rev.004 www.rohm.com tsz22111 ? 15 ? 001 2) fault status output this function is used to output a fault signal from the flt pin when a fault occurs (i.e., when the undervoltage lockout function (uvlo), short current protection function (scp) or t hermal protection function is activated) and hold the fault signal until the set fault output holding time is completed. the fault output holding time t fltrls is given as the following equation with the settings of capacitor c fltrls and resistor r fltrls connected to the fltrls pin. for example, when c fltrls is set to 0.01 ? f and r fltrls is set to 200k ? , the holding time will be set to 2 ms. t fltrls [ms]= c fltrls [ ? f]?r fltrls [k ? ] to set the fault output holding time to ?0? ms, only connect the resistor r fltrls . status flt pin normal hi-z fault occurs l 3) undervoltage lockout (uvlo) function the bm6103fv-c incorporates the undervoltage lockout (uvlo) function both on the low and the high voltage sides. when the power supply voltage drops to the uvlo on vo ltage, the out pin and the flt pin both will output the ?l? signal. when the power supply voltage rises to the uvlo off voltage, these pins will be reset. however, during the fault output holding time set in ?2) fault status output? section, the out pi n and the flt pin will hold the ?l? signal. in addition, to prevent malfunctions due to noises, mask time t uvlo1msk and t uvlo2msk are set on both low and high voltage sides. in l h vcc2 v uvlo2h v uvlo2l flt hi-z l out1 l h hi-z figure 9. output-side uvlo operation timing chart figure 8. input-side uvlo f unction operation timing chart vcc1 v uvlo1h v uvlo1l flt hi-z l out1 l h l h in figure 7. fault output block diagram ecu vcc1 fltrls flt gnd1 r fltrls c fltrls uvlo scp vts logic mask flt mask mask mask - - + r s figure 6. fault status output timing chart flt hi-z l out l h v fltrls fltrls fault output holding time (t fltrls ) status fault occurs (the uvlo, scp or thermal protection)
6/31 datasheet d a t a s h e e t bm6103fv-c tsz02201-0717abh00010-1-2 ? 2012 rohm co., ltd. all rights reserved. 29.aug.2012 rev.004 www.rohm.com tsz22111 ? 15 ? 001 4) short current protection function (scp, desat) when the scpin pin voltage exceeds a voltage set with the v scdet parameter, the scp function will be activated. when the scp function is activated, t he out1 pin voltage will be set to the ?hi-z? level first, and then the proout pin voltage to the ?l? level (soft turn-off).next, after t sto has passed after the short-circuit current falls below the threshold value, out pin becomes l and proout pin becomes l. finally, when the fault output holding time set in ?2) fault status output? section on page 5 is completed, the scp function will be released. when out1=l or hi-z, internal mosfet connec ted to scpin pin turns on to discharge c blank . when out1=h, internal mosfet connected to scpin turns off. v collector /v drain which desaturation protection starts operation (v desat ) and the blanking time (t blank ) can be calculated by the formula below; figure 10. block diagram for desat v desat reference value r1 r2 r3 4.0v 15 k 39 k 6.8 k 4.5v 15 k 43 k 6.8 k 5.0v 15 k 36 k 5.1 k 5.5v 15 k 39 k 5.1 k 6.0v 15 k 43 k 5.1 k 6.5v 15 k 62 k 6.8 k 7.0v 15 k 68 k 6.8 k 7.5v 15 k 82 k 7.5 k 8.0v 15 k 91 k 8.2 k 8.5v 15 k 82 k 6.8 k 9.0v 15 k 130 k 10 k 9.5v 15 k 91 k 6.8 k 10.0v 15 k 130 k 9.1 k ?? ?? ?? 6 2 12 outernal 2 10 65 . 0 ) 3 1 2 3 1 ln( ) 10 27 ( 3 1 2 3 1 2 3 1 2 3 3 2 3 ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? cc scdet blank blank scdet cc f scdet desat v v r r r r c r r r r r r s t r r r r v v v v r r r v v v min d logic predriver predriver predriver scpmsk - + logic - + ecu vcc2 out proout scpin gnd2 vee2 vcc1 in fltrls flt gnd1 s r input side output side v tfltrls v scdet r fltrls c fltrls r sto logic predriver predriver predriver scpmsk - + - + logic - + - + ecu s r input side output side v tfltrls v scdet r sto logic predriver predriver predriver scpmsk - + - + logic - + - + ecu vcc2 out proout scpin gnd2 vee2 vcc1 in fltrls flt gnd1 s r input side output side v tfltrls v scdet r fltrls c fltrls r sto logic predriver predriver predriver scpmsk r r 1 - + - + logic - + - + ecu s r input side output side v tfltrls v scdet r sto r r r r 2 3 c bl an k logic predriver predriver predriver scpmsk - + - + logic - + - + ecu vcc2 out proout scpin gnd2 vee2 vcc1 in fltrls flt gnd1 s r input side output side v tfltrls v scdet r fltrls c fltrls r sto logic predriver predriver predriver scpmsk - + - + logic - + - + ecu s r input side output side v tfltrls v scdet r sto logic predriver predriver predriver scpmsk - + - + logic - + - + ecu vcc2 out proout scpin gnd2 vee2 vcc1 in fltrls flt gnd1 s r input side output side v tfltrls v scdet r fltrls c fltrls r sto logic predriver predriver predriver scpmsk r r 1 - + - + logic - + - + ecu s r input side output side v tfltrls v scdet r sto r r r r 2 3 c bl an k
7/31 datasheet d a t a s h e e t bm6103fv-c tsz02201-0717abh00010-1-2 ? 2012 rohm co., ltd. all rights reserved. 29.aug.2012 rev.004 www.rohm.com tsz22111 ? 15 ? 001 fault output holding time *7 flt proout scpin out1 in hi-z l hi-z l v scdet l hi-z h h l t sto out2 hi-z h l fault output holding time *7 t sto figure 11. scp operation timing chart *7: ?2) fault status output? section on page 5 figure 12. desat sequence v scdet ( typ. 0.7v) v scdet t blankouternal t blankouternal t blank t blank ina out1 out2 proout scpin flt v scdet ( typ. 0.7v) v scdet t blankouternal t blankouternal t blank t blank t scpmsk +t comp_dela y t scpmsk +t comp_delay (typ. 0.95us) t comp_delay : detection delay time of internal comparator
8/31 datasheet d a t a s h e e t bm6103fv-c tsz02201-0717abh00010-1-2 ? 2012 rohm co., ltd. all rights reserved. 29.aug.2012 rev.004 www.rohm.com tsz22111 ? 15 ? 001 figure 13. scp operation st atus transition diagram v scpin >v scdet ye s no start out1=hi-z, out2=l, proout=l, flt=l out1=h, out2=l, proout=hi-z exceed mask time ye s no v fltrls >v tfltrls ye s no in=h ye s no v scpin 9/31 datasheet d a t a s h e e t bm6103fv-c tsz02201-0717abh00010-1-2 ? 2012 rohm co., ltd. all rights reserved. 29.aug.2012 rev.004 www.rohm.com tsz22111 ? 15 ? 001 5 i/o condition table no. status input output vcc1 vcc2 v t s i n s c p i n f l t e n a i n b i n a p r o o u t o u t 1 o u t 2 p r o o u t f l t 1 scp x x x h x x x x x hi-z l l l 2 vcc1uvlo uvlo x x l x x x x h l hi-z hi-z l 3 uvlo x x l x x x x l l h hi-z l 4 vcc2uvlo x uvlo x l x x x x h l hi-z hi-z l 5 x uvlo x l x x x x l l h hi-z l 6 thermal protection l l x x x x h l hi-z hi-z l 7 l l x x x x l l h hi-z l 8 flt external input h l l x x x h l hi-z hi-z hi-z 9 h l l x x x l l h hi-z hi-z 10 disable h l h h x x h l hi-z hi-z hi-z 11 h l h h x x l l h hi-z hi-z 12 non-invert operation l input h l h l l l h l hi-z hi-z hi-z 13 h l h l l l l l h hi-z hi-z 14 non-invert operation h input h l h l l h x h l hi-z hi-z 15 invert operation l input h l h l h l x h l hi-z hi-z 16 invert operation h input h l h l h h h l hi-z hi-z hi-z 17 h l h l h h l l h hi-z hi-z : vcc1 or vcc2 > uvlo, x:don't care
10/31 datasheet d a t a s h e e t bm6103fv-c tsz02201-0717abh00010-1-2 ? 2012 rohm co., ltd. all rights reserved. 29.aug.2012 rev.004 www.rohm.com tsz22111 ? 15 ? 001 6) power supply startup / shutoff sequence out1 proout flt vcc1 vcc2 vee2 in h l h l hi-z l hi-z l hi-z v uvlo2l v uvlo1h v uvlo2l v uvlo1h v uvlo2l v uvlo1h 0v 0v 0v out2 l hi-z h out1 proout flt vcc1 vcc2 vee2 in h l h l hi-z l hi-z l hi-z v uvlo2h v uvlo1l v uvlo2h v uvlo1l v uvlo2l v uvlo1h 0v 0v 0v out2 l hi-z h out1 proout flt vcc1 vcc2 vee2 in h l h l hi-z l hi-z l hi-z v uvlo2h v uvlo1l v uvlo2l v uvlo1h v uvlo2l v uvlo1h 0v 0v 0v out2 l hi-z h out1 proout flt vcc1 vcc2 vee2 in h l h l hi-z l hi-z l hi-z v uvlo2h v uvlo1l v uvlo2h v uvlo1l v uvlo2h v uvlo1l 0v 0v 0v out2 l hi-z h : since the vcc2 to vee2 pin voltage is low and the output mos does not turn on, the output pins become hi-z conditions. : since the vcc1 pin voltage is low and the flt output mos does not turn on, the output pins become hi-z conditions. figure 15. power supply startup / shutoff sequence
11/31 datasheet d a t a s h e e t bm6103fv-c tsz02201-0717abh00010-1-2 ? 2012 rohm co., ltd. all rights reserved. 29.aug.2012 rev.004 www.rohm.com tsz22111 ? 15 ? 001 absolute maximum ratings *1 relative to gnd1. *2 relative to gnd2. *3 should not exceed pd and tj=150 ? c. *4 derate above ta=25 ? c at a rate of 9.5mw/ ? c. mounted on a glass epoxy of 70 mm ? 70 mm ? 1.6 mm. recommended operating ratings parameter symbol min. max. units input-side supply voltage v cc1 *5 4.5 5.5 v output-side positive supply voltage v cc2 *6 14 24 v output-side negative supply voltage v ee2 *6 -12 0 v maximum difference between output-side positive and negative voltages v max2 14 32 v vtsin pin input voltage v vtsin *6 0 5 v *5 relative to gnd1. *6 relative to gnd2. insulation related characteristics parameter symbol characteristic units insulation resistance (v io =500v) r s >10 9 insulation withstand voltage / 1min v iso 2500 vrms insulation test voltage / 1sec v iso 3000 vrms parameter symbol limits unit input-side supply voltage v cc1 -0.3 to +7.0 *1 v output-side positive supply voltage v cc2 -0.3 to +30.0 *2 v output-side negative supply voltage v ee2 -15.0 to +0.3 *2 v maximum difference between output-side positive and negative voltages v max2 36.0 v ina, inb, ena pin input voltage v in -0.3 to +vcc1+0.3 or 7.0 *1 v flt pin input voltage v flt -0.3 to +vcc1+0.3 or 7.0 *1 v fltrls pin input voltage v fltrls -0.3 to +vcc1+0.3 or 7.0 *1 v vtsin pin input voltage v vtsin -0.3 to +10.0 *2 v scpin pin input voltage v scpin -0.3 to +10.0 *2 v vreg pin output current i vreg 10 ma out1 pin output current (dc) i out1 0.4 *3 a out1 pin output current (peak 1us) i out1peak 5.0 a out2 pin output current (dc) i out2 0.1 *3 a out2 pin output current (peak 1us) i out2peak 1 a proout pin output current i proout 0.2 *3 a flt output current i flt 10 ma power dissipation p d 1.19 *4 w operating temperature range t opr -40 to +125 storage temperature range t stg -55 to +150 junction temperature t jmax +150
12/31 datasheet d a t a s h e e t bm6103fv-c tsz02201-0717abh00010-1-2 ? 2012 rohm co., ltd. all rights reserved. 29.aug.2012 rev.004 www.rohm.com tsz22111 ? 15 ? 001 electrical characteristics unless otherwise specified t a =-40 to 125 , v cc1 =4.5v to 5.5v, v cc2 =14v to 24v, v ee2 =-12v to 0v parameter symbol min. typ. max. unit conditions general input side circuit current 1 i cc1 0.20 0.45 0.70 ma out=l input side circuit current 2 i cc12 0.20 0.45 0.70 ma out=h input side circuit current 3 i cc13 1.2 2.0 2.8 ma ina=10khz, duty=50% input side circuit current 4 i cc14 2.1 3.5 4.9 ma ina=20khz, duty=50% output side circuit current 1 i cc21 1.9 3.2 4.5 ma vcc2=14v, out=l output side circuit current 2 i cc22 1.3 2.1 2.9 ma vcc2=14v, out=h output side circuit current 3 i cc23 2.1 3.5 4.9 ma vcc2=18v, out=l output side circuit current 4 i cc24 1.4 2.4 3.4 ma vcc2=18v, out=h output side circuit current 5 i cc25 2.4 4.0 5.6 ma vcc2=24v, out=h output side circuit current 6 i cc26 1.6 2.7 3.8 ma vcc2=24v, out=l logic block logic high level input voltage v inh 0.7 v cc1 - v cc1 v ina, inb, ena, flt logic low level input voltage v inl 0 - 0.3 v cc1 v ina, inb, ena, flt logic pull-down resistance r ind 25 50 100 k ina, inb logic pull-up resistance r inu 25 50 100 k ena logic input mask time t inmsk 80 130 180 ns ina, inb ena, flt mask time t fltmsk 4 10 20 s ena, flt output out1 on resistance (source) r onh 0.7 1.8 4.0 i out =40ma out1 on resistance (sink) r onl 0.4 0.9 2.0 i out =40ma out1 maximum current i outmax 3.0 4.5 - a vcc2=18v design assurance proout on resistance r onpro 0.4 0.9 2.0 i proout =40ma turn on time t pon 180 265 350 ns turn off time t poff 180 265 350 ns propagation distortion t pdist -60 0 60 ns t poff - t pon rise time t rise - 50 100 ns 10nf between out1-vee2 fall time t fall - 50 100 ns 10nf between out1-vee2 out2 on resistance (source) r on2h 2.0 4.5 9.0 i out2 =40ma out2 on resistance (sink) r on2l 1.5 3.5 7.0 i out2 =40ma out2 on threshold voltage v out2on 1.8 2 2.2 v relative to vee2 out2 output delay time t out2on - 15 50 ns vreg output voltage v reg 9 10 11 v relative to vee2 common mode transient immunity cm 100 - - kv/ s design assurance protection functions vcc1 uvlo off voltage v uvlo1h 4.05 4.25 4.45 v vcc1 uvlo on voltage v uvlo1l 3.95 4.15 4.35 v vcc1 uvlo mask time t uvlo1msk 4 10 30 s vcc2 uvlo off voltage v uvlo2h 11.5 12.5 13.5 v vcc2 uvlo on voltage v uvlo2l 10.5 11.5 12.5 v vcc2 uvlo mask time t uvlo2msk 4 10 30 s scpin input voltage v scpin - 0.1 0.22 v i scpin =1ma scp detection voltage v scdet 0.665 0.700 0.735 v scp detection mask time t scpmsk 0.55 0.8 1.05 soft turn off release time t sto 30 110 s thermal detection voltage v tsdet 1.60 1.70 1.80 v thermal detection mask time t tsmsk 4 10 30 s flt output low voltage v fltl - 0.18 0.40 v i flt =5ma fltrls threshold v tfltrls 0.64 v cc1 -0.1 0.64 v cc1 0.64 v cc1 +0.1 v
13/31 datasheet d a t a s h e e t bm6103fv-c tsz02201-0717abh00010-1-2 ? 2012 rohm co., ltd. all rights reserved. 29.aug.2012 rev.004 www.rohm.com tsz22111 ? 15 ? 001 typical performance curves ina out1 t rise t fall t pon t poff 50% 50% 90% 50% 50% 90% 10% 10% figure 16. ina-out1 timing chart 0.2 0.3 0.4 0.5 0.6 0.7 4.50 4.75 5.00 5.25 5.50 vcc1 [v] icc11 [ma] 0.2 0.3 0.4 0.5 0.6 0.7 -40-20 0 20406080100120 ta [ ] icc11 [ma] figure 17. input side circuit current (at out1=l) figure 18. input side circuit current (at out1=l) ta=125 ta = 2 5 ta = - 4 0 vcc1=5.5v vcc1=5.0v vcc1=4.5v
14/31 datasheet d a t a s h e e t bm6103fv-c tsz02201-0717abh00010-1-2 ? 2012 rohm co., ltd. all rights reserved. 29.aug.2012 rev.004 www.rohm.com tsz22111 ? 15 ? 001 figure 19. input side circuit current (at out1=h) figure 20. input side circuit current (at out1=h) figure 21. input side circuit current (at ina=10khz and duty=50%) figure 22. input side circuit current (at ina=10khz and duty=50%) 0.2 0.3 0.4 0.5 0.6 0.7 4.50 4.75 5.00 5.25 5.50 vcc1 [v] icc12 [ma] ta=125 ta = 2 5 ta = - 4 0 0.2 0.3 0.4 0.5 0.6 0.7 -40-20 0 20406080100120 ta [ ] icc12 [ma] vcc1=5.5v vcc1=5.0v vcc1=4.5v 1.2 1.6 2.0 2.4 2.8 4.50 4.75 5.00 5.25 5.50 vcc1 [v] icc13 [ma] 1.2 1.6 2.0 2.4 2.8 -40-20 0 20406080100120 ta [ ] icc13 [ma] vcc1=5.5v vcc1=5.0v vcc1=4.5v ta=125 ta = 2 5 ta = - 4 0
15/31 datasheet d a t a s h e e t bm6103fv-c tsz02201-0717abh00010-1-2 ? 2012 rohm co., ltd. all rights reserved. 29.aug.2012 rev.004 www.rohm.com tsz22111 ? 15 ? 001 figure 23. input side circuit current (at ina=20khz and duty=50%) figure 24. input side circuit current (at ina=20khz and duty=50%) figure 25. output side circuit current (at out1=l) figure 26. output side circuit current (at out1=l) 2.1 2.5 2.9 3.3 3.7 4.1 4.5 4.9 4.50 4.75 5.00 5.25 5.50 vcc1 [v] icc14 [ma] 2.1 2.5 2.9 3.3 3.7 4.1 4.5 4.9 -40 -20 0 20 40 60 80 100 120 ta [ ] icc14 [ma] 1.2 1.6 2.0 2.4 2.8 3.2 3.6 4.0 4.4 4.8 5.2 5.6 14 16 18 20 22 24 vcc2 [v] icc2x [ma] 1.2 1.6 2.0 2.4 2.8 3.2 3.6 4.0 4.4 4.8 5.2 5.6 -40-20 0 20406080100120 ta [ ] icc2x [ma] ta=125 ta = 2 5 ta = - 4 0 vcc2=24v vcc2=18v vcc2=14v ta=125 ta = 2 5 ta = - 4 0 vcc1=5.5v vcc1=5.0v vcc1=4.5v
16/31 datasheet d a t a s h e e t bm6103fv-c tsz02201-0717abh00010-1-2 ? 2012 rohm co., ltd. all rights reserved. 29.aug.2012 rev.004 www.rohm.com tsz22111 ? 15 ? 001 figure 29. logic (ina/inb/ena) high/low level input voltage figure 30. logic (ina/inb/ena) high/low level input voltage at ta=25 figure 27. output side circuit current (at out1=h) figure 28. output side circuit current (at out1=h) 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 4.50 4.75 5.00 5.25 5.50 vcc1 [v] vinh / vinl [v] h ? ta=125 ta = 2 5 ta = - 4 0 ta = - 4 0 ta = 2 5 ta=125 l ? 1.2 1.6 2.0 2.4 2.8 3.2 3.6 4.0 4.4 4.8 5.2 5.6 14 16 18 20 22 24 vcc2 [v] icc2x [ma] ta=125 ta = 2 5 ta = - 4 0 1.2 1.6 2.0 2.4 2.8 3.2 3.6 4.0 4.4 4.8 5.2 5.6 -40-20 0 20406080100120 ta [ ] icc2x [ma] vcc2=24v vcc2=18v vcc2=14v 0 4 8 12 16 20 24 012345 ina [v] out1 [v] vcc1=5v
17/31 datasheet d a t a s h e e t bm6103fv-c tsz02201-0717abh00010-1-2 ? 2012 rohm co., ltd. all rights reserved. 29.aug.2012 rev.004 www.rohm.com tsz22111 ? 15 ? 001 figure 31. logic pull-down resistance figure 32. logic pull-up resistance figure 33. logic (ina/inb) input mask time (high pulse) figure 34. logic (ina/inb) input mask time (low pulse) 25.0 50.0 75.0 100.0 4.50 4.75 5.00 5.25 5.50 vcc1 [v] rinu [k ] 25.0 50.0 75.0 100.0 4.50 4.75 5.00 5.25 5.50 vcc1 [v] rind [k ] ta=125 80.0 100.0 120.0 140.0 160.0 180.0 4.50 4.75 5.00 5.25 5.50 vcc1 [v] tinmsk [ns] ta = - 4 0 ta = 2 5 ta=125 80.0 100.0 120.0 140.0 160.0 180.0 4.50 4.75 5.00 5.25 5.50 vcc1 [v] tinmsk [ns] ta = - 4 0 ta = 2 5 ta = - 4 0 ta = 2 5 ta=125 ta=125 ta = - 4 0 ta = 2 5
18/31 datasheet d a t a s h e e t bm6103fv-c tsz02201-0717abh00010-1-2 ? 2012 rohm co., ltd. all rights reserved. 29.aug.2012 rev.004 www.rohm.com tsz22111 ? 15 ? 001 figure 35. ena input mask time figure 36. flt input mask time figure 37. out1 on resistance (source) figure 38. out1 on resistance (sink) 4 8 12 16 20 4.50 4.75 5.00 5.25 5.50 vcc1 [v] tfltmsk [us] ta = - 4 0 ta = 2 5 ta=125 4 8 12 16 20 4.50 4.75 5.00 5.25 5.50 vcc1 [v] tfltmsk [us] ta = - 4 0 ta = 2 5 ta=125 0.7 1.3 1.9 2.5 3.1 3.7 14 16 18 20 22 24 vcc2 [v] ronh [ ] ta = - 4 0 ta = 2 5 ta=125 0.4 0.8 1.2 1.6 2.0 14 16 18 20 22 24 vcc2 [v] ronl [ ] ta=125 ta = 2 5 ta = - 4 0
19/31 datasheet d a t a s h e e t bm6103fv-c tsz02201-0717abh00010-1-2 ? 2012 rohm co., ltd. all rights reserved. 29.aug.2012 rev.004 www.rohm.com tsz22111 ? 15 ? 001 figure 39. proout on resistanc e figure 40. turn on time figure 41. turn off time figure 42. rise time (10nf between out1-vee2) 0.4 0.8 1.2 1.6 2.0 14 16 18 20 22 24 vcc2 [v] ronpro [ ] ta=125 ta = 2 5 ta = - 4 0 180 220 260 300 340 14 16 18 20 22 24 vcc2 [v] tpon [n] 150 200 250 300 350 400 14 16 18 20 22 24 vcc2 [v] tpoff [ns] ta = 2 5 ta = - 4 0 ta=125 ta = 2 5 ta = - 4 0 ta=125 0 10 20 30 40 50 60 70 80 90 100 14 16 18 20 22 24 vcc2 [v] trise [ns] ta = 2 5 ta = - 4 0 ta=125
20/31 datasheet d a t a s h e e t bm6103fv-c tsz02201-0717abh00010-1-2 ? 2012 rohm co., ltd. all rights reserved. 29.aug.2012 rev.004 www.rohm.com tsz22111 ? 15 ? 001 figure 43. fall time (10nf between out1-vee2) figure 44. out2 on resistance (source) figure 45. out2 on resistance (sink) figure 46. out2 on threshold voltage 2.0 3.0 4.0 5.0 6.0 7.0 8.0 9.0 14 16 18 20 22 24 vcc2 [v] ron2h [ ] 1.5 2.5 3.5 4.5 5.5 6.5 14 16 18 20 22 24 vcc2 [v] ron2l [ ] ta = 2 5 ta=125 ta = - 4 0 ta = 2 5 ta=125 ta = - 4 0 1.8 1.9 2.0 2.1 2.2 14 16 18 20 22 24 vcc2 [v] vout2on [v] ta=125 ta = - 4 0 ta = 2 5 0 10 20 30 40 50 60 70 80 90 100 14 16 18 20 22 24 vcc2 [v] tfall [ns] ta=125 ta = 2 5 ta = - 4 0
21/31 datasheet d a t a s h e e t bm6103fv-c tsz02201-0717abh00010-1-2 ? 2012 rohm co., ltd. all rights reserved. 29.aug.2012 rev.004 www.rohm.com tsz22111 ? 15 ? 001 figure 47. out2 output delay time figure 48. vreg output voltage figure 49. vreg output voltage figure 50. vcc1 uvlo on/off voltage 0 10 20 30 40 50 14 16 18 20 22 24 vcc2 [v] tout2on [ns] ta=125 ta = 2 5 ta = - 4 0 9.0 9.5 10.0 10.5 11.0 14 16 18 20 22 24 vcc2 [v] vreg [v] ta = - 4 0 ta = 2 5 ta=125 9.0 9.5 10.0 10.5 11.0 -40-20 0 20406080100120 ta [ ] vreg [v] vcc2=24v vcc2=18v vcc2=14v 0 1 2 3 4 5 3.95 4.05 4.15 4.25 4.35 4.45 vcc1 [v] flt [v] ta=125 ta = - 4 0 ta = 2 5 ta = 2 5 ta = - 4 0 ta=125
22/31 datasheet d a t a s h e e t bm6103fv-c tsz02201-0717abh00010-1-2 ? 2012 rohm co., ltd. all rights reserved. 29.aug.2012 rev.004 www.rohm.com tsz22111 ? 15 ? 001 figure 51. vcc1 uvlo mask time figure 52. vcc2 uvlo on/off voltage (at vcc1=5v) figure 53. vcc2 uvlo mask time figure 54. scpin input voltage (at iscpin=1ma) 0.00 0.11 0.22 14 16 18 20 22 24 vcc2 [v] vscpin [v] 4 8 12 16 20 24 28 -40-20 0 20406080100120 ta [ ] tuvlo1msk [us] 0 1 2 3 4 5 6 10.5 11.5 12.5 13.5 vcc2 [v] flt [v] ta=125 ta = 2 5 ta = - 4 0 ta = - 4 0 ta = 2 5 ta=125 4 8 12 16 20 24 28 -40-20 0 20406080100120 ta [ ] tuvlo2msk [us] ta = - 4 0 ta = 2 5 ta=125
23/31 datasheet d a t a s h e e t bm6103fv-c tsz02201-0717abh00010-1-2 ? 2012 rohm co., ltd. all rights reserved. 29.aug.2012 rev.004 www.rohm.com tsz22111 ? 15 ? 001 figure 55. scp detection voltage figure 56. scp detection mask time figure 57. soft turn off release time figure 58. thermal detection voltage 0.67 0.70 0.73 14 16 18 20 22 24 vcc2 [v] vscdet [v] ta = 2 5 ta = - 4 0 ta=125 0.55 0.65 0.75 0.85 0.95 1.05 14 16 18 20 22 24 vcc2 [v] tscpmsk [us] 1.6 1.7 1.8 14 16 18 20 22 24 vcc2 [v] vtsdet [v] ta = - 4 0 ta=125 ta = 2 5 30 50 70 90 110 -40-20 0 20406080100120 ta [ ] tsto [us] vcc2=14v vcc2=18v vcc2=24v max. min. vcc2=14v vcc2=18v vcc2=24v ta = 2 5 ta=125 ta = - 4 0
24/31 datasheet d a t a s h e e t bm6103fv-c tsz02201-0717abh00010-1-2 ? 2012 rohm co., ltd. all rights reserved. 29.aug.2012 rev.004 www.rohm.com tsz22111 ? 15 ? 001 figure 59. thermal detection mask time figure 60. flt output low voltage (iflt=5ma) figure 61. fltrls threshold 4.0 8.0 12.0 16.0 20.0 24.0 28.0 14 16 18 20 22 24 vcc2 [v] ttsmsk [us] ta=125 ta = 2 5 ta = - 4 0 0.0 0.1 0.2 0.3 0.4 4.50 4.75 5.00 5.25 5.50 vcc2 [v] vfltl [v] 2.78 2.99 3.20 3.41 3.62 4.50 4.75 5.00 5.25 5.50 vcc1 [v] vtfltrls [v] ta = - 4 0 ta=125 ta = 2 5 ta = - 4 0 ta = 2 5 ta=125
25/31 datasheet d a t a s h e e t bm6103fv-c tsz02201-0717abh00010-1-2 ? 2012 rohm co., ltd. all rights reserved. 29.aug.2012 rev.004 www.rohm.com tsz22111 ? 15 ? 001 selection of components externally connected r flt rls c flt rls out1 vtsin input s ide chip nc gnd1 gnd1 ina timer timer uvlo fltrls vcc1 output s ide chip test vee2 mask vreg out2 flt vcc2 logic s r q proout vee2 pre driver mask mask mask fb c vcc1 c vcc2 flt ena ecu inb gnd2 mask logic mask flt temp se nsor uvlo scpin vee2 r flt rls c flt rls out1 vtsin input side chip nc gnd1 gnd1 ina timer timer uvlo fltrls vcc1 output side chip test vee2 mask vreg out2 flt vcc2 logic s r q proout vee2 pre driver mask mask mask fb c vcc1 c vcc2 flt ena ecu inb gnd2 mask logic mask flt temp se nsor uvlo scpin vee2 figure 62. for using 4-pin igbt (for using scp function) figure 63. for using 3-pin igbt (for using desat function recommended rohm mcr03ezp recommended rohm mcr03ezp recommended rohm mcr03ezp recommended rohm rsr025n3 rss065n03 recommended rohm rsr025n3 rss065n03 recommended rohm mcr03ezp
26/31 datasheet d a t a s h e e t bm6103fv-c tsz02201-0717abh00010-1-2 ? 2012 rohm co., ltd. all rights reserved. 29.aug.2012 rev.004 www.rohm.com tsz22111 ? 15 ? 001 power dissipation thermal design please design that the ic?s chip temperature tj is not over 150 , while considering the ic?s power consumption (w), package power (pd) and ambient temperature (ta). when tj=150 is exceeded the functions as a semiconductor do not operate and some problems (ex. abnormal operation of various parasitic elements and increasing of leak current) occur. constant use under these circumstances leads to deterioration and eventually ic may destruct. tjmax=150 must be strictly obeyed under all circumstances. the ic?s consumed power (p) can be estimated roughly with following equation. p v cc1 ? i cc1 + v cc2 ? i gnd2 + v cc2 + v ee2 ? i cc2 -i gnd2 + i on 2 ? r onh ? t on ? f pwm + i off 2 ? r onl ? t off ? f pwm f pwm : pwm frequency i on : out pin outflow current when out is h state. t on : current outflow time from out pin when out is h state. i off : out pin inflow current when out is l state. t off : current inflow time to out pin when out is l state. 0 25 50 75 100 125 150 0 0.5 1.0 1.5 ambient temperature:t a [ ] power dissipation:p d [w] 1.19w 0 25 50 75 100 125 150 0 0.5 1.0 1.5 ambient temperature:t a [ ] power dissipation:p d [w] 0 25 50 75 100 125 150 0 0.5 1.0 1.5 ambient temperature:t a [ ] power dissipation:p d [w] 0 25 50 75 100 125 150 0 0.5 1.0 1.5 ambient temperature:t a [ ] power dissipation:p d [w] 1.19w measurement machine th156 kuwano electric measurement condition rohm board board size 70 70 1.6mm 3 1-layer board ja =105.3 /w figure 64. ssop-b20w derating curve
27/31 datasheet d a t a s h e e t bm6103fv-c tsz02201-0717abh00010-1-2 ? 2012 rohm co., ltd. all rights reserved. 29.aug.2012 rev.004 www.rohm.com tsz22111 ? 15 ? 001 i/o equivalence circuits pin no. name i/o equivalence circuits function 1 vtsin vcc2 scpin vee2 gnd2 vtsin internal pow er supply thermal detection pin 4 scpin short current detection pin 5 out2 vee2 vcc2 out2 vreg internal pow er supply mos fet control pin for miller clamp 6 vreg power supply pin for driving mos fet for miller clamp 8 out out1 vee2 vcc2 output pin 10 proout proout vee2 vcc2 vreg soft turn-off pin
28/31 datasheet d a t a s h e e t bm6103fv-c tsz02201-0717abh00010-1-2 ? 2012 rohm co., ltd. all rights reserved. 29.aug.2012 rev.004 www.rohm.com tsz22111 ? 15 ? 001 pin no. name i/o equivalence circuits function 14 fltrls fltrls gnd1 vcc1 fault output holding time setting pin 16 flt flt gnd1 vcc1 fault output pin 13 inb ina, inb gnd1 vcc1 invert / non-invert selection pin 17 ina control input pin 18 ena ena gnd1 vcc1 input enabling signal input pin 19 test test gnd1 vcc1 test mode setting pin
29/31 datasheet d a t a s h e e t bm6103fv-c tsz02201-0717abh00010-1-2 ? 2012 rohm co., ltd. all rights reserved. 29.aug.2012 rev.004 www.rohm.com tsz22111 ? 15 ? 001 operational notes (1) absolute ma ximum ratings an excess in the absolute maximum ratings, such as supply voltage, temperature range of operating conditions, etc., can break down the devices, thus making impossible to ident ify breaking mode, such as a short circuit or an open circuit. if any over rated values will expect to exceed the ab solute maximum ratings, consider adding circuit protection devices, such as fuses. (2) connecting the power supply connector backward connecting of the power supply in reverse polarity can damage ic. take precautions when connecting the power supply lines. an external direction diode can be added. (3) power supply lines design pcb layout pattern to provide low impedance gnd and supply lines. to obtain a low noise ground and supply line, separate the ground secti on and supply lines of the digi tal and analog blocks. furthe rmore, for all power supply terminals to ics, connect a capacitor between the power supply and the gnd terminal. when applying electrolytic capacitors in the circuit, not that capacitance char acteristic values are reduced at low temperatures. (4) gnd1 potential the potential of gnd1 pin must be minimum potential in all operating conditions. (input side ; 11pin to 20pin) (5) vee2 potential the potential of vee2 pin must be minimum potential in a ll operating conditions. (output side ; 1pin to 10pin) (6) thermal design use a thermal design that allows for a sufficient margin in li ght of the power dissipation (pd) in actual operating conditions. (7) inter-pin shorts and mounting errors when attaching to a printed circuit board, pay close attention to the direction of the ic and displacement. improper attachment may lead to destruction of the ic. there is also possibility of destruction from short circuits which can be caused by foreign matter entering between outputs or an output and the power supply or gnd. (8) operation in a strong electric field use caution when using the ic in the presence of a strong electromagnetic field as doing so may cause the ic to malfunction. (9) inspection of the application board during inspection of the application board, if a capacitor is connected to a pin with low impedance there is a possibility that it could cause stress to the ic, therefore an electrical discharge should be performed after each process. also, as a measure again electrostatic discharge, it should be earthed during the assembly process and special care should be taken during transport or storage. furthermore, when connecti ng to the jig during the inspection process, the power supply should first be turned off and then removed before the inspection. (10) input terminal of ic between each element there is a p+ isolation for element partition and a p substrate. this p layer and each element?s n layer make up the p-n junction, and various parasitic elements are made up. for example, when the resistance and transistor are connected to the terminal as shown in figure 65, when gnd (terminal a) at the resistance and gnd (terminal b) at the transistor (npn), the p-n junction operates as a parasitic diode. also, when gnd (terminal b) at the transistor (npn), the parasitic npn transistor operates with the n layers of other elements close to the aforementioned parasitic diode. because of the ic?s structure, the creation of parasitic elements is inevitable from the electrical potential relationship. the operation of parasitic elements causes interference in circuit operation, and can lead to malfunction and destruction. therefore, be careful not to use it in a way which causes the parasitic elements to operate, such as by applying voltage that is lower than the gnd (p substrate) to the input terminal. figure 65. pattern diagram of parasitic element resistor transistor (npn) n n n p + p + p p substrate gnd parasitic element terminal a n n p + p + p p substrate gnd parasitic element terminal b c b e n gnd terminal a terminal b other adjacent elements e b c gnd p aras iti c element p aras iti c element
30/31 datasheet d a t a s h e e t bm6103fv-c tsz02201-0717abh00010-1-2 ? 2012 rohm co., ltd. all rights reserved. 29.aug.2012 rev.004 www.rohm.com tsz22111 ? 15 ? 001 (11) ground wiring patterns when using both small signal and large current gnd patterns, it is recommended to isolate the two ground patterns, placing a single ground point at the application's reference point so that the pattern wiring resistance and voltage variations caused by large currents do not cause variations in the small signal ground voltage. be careful not to change the gnd wiring pattern potential of any external components, either. the japanese version of this document is formal specification. a customer may use this translation version only for a reference to help reading the formal version. if there are any differences in translation version of this document formal version takes priority ordering information b m 6 1 0 3 f v -ce 2 part number package fv:ssop-b20w packaging and forming specification e2: embossed tape and reel physical dimension tape and reel information marking diagram ssop-b20w(top view) bm6103 part number marking lot number 1pin mark ? order quantity needs to be multiple of the minimum quantity. embossed carrier tape tape quantity direction of feed the direction is the 1pin of product is at the upper left when you hold reel on the left hand and you pull out the tape on the right hand 2000pcs e2 () direction of feed reel 1pin (unit : mm) ssop-b20w 0.1 8.1 0.3 1.7 0.2 6.1 0.2 0.65 0.11 1 0.22 0.1 10 6.5 0.2 20 11 0.15 0.1 0.3min.
31/31 datasheet d a t a s h e e t bm6103fv-c tsz02201-0717abh00010-1-2 ? 2012 rohm co., ltd. all rights reserved. 29.aug.2012 rev.004 www.rohm.com tsz22111 ? 15 ? 001 revision history date revision changes 7.mar.2012 001 new release 29.may.2012 002 page 1 change general description, key specifications ?i/o delay time, minimum input pulse width?. page 1 change applications. page 2 change pin description ?out2, vreg pin?. page 3 change description of pins and cautions on layout of board ?out2, vreg pin?. page 4 change description of functions and example of constant setting ?1)?. page 6 change description of functions and example of constant setting?4)? equation of t blankouternal . page 11 delete absolute maximum rating ?output-side ground potential ? . page 11 add insulation related characteristics. page 12 change electrical characteristics ?turn on time, turn off time? . page 25 delete recommended part number ? rhk005n03?. page 27 change function of i/o equivalence circuit ?out2, vreg pin? . page 28 change pin no. of i/o equivalence circuit ?test pin? . 15.jun.2012 003 page 3 change description of pins and cautions on layout of board ?vreg, proout pin?. page 5 change description of functions and example of constant setting ?2) figure 7? . page 12 add electrical characteristics ?common mode transient immunity? . page 12 change electrical characteristics ?scp detection voltage? . page 29 change operation note ?(4) and (5)?. 28.aug.2012 004 page 6 add description of functions and example of constant setting ?4)? explanation of internal mosfet connected to scpin pin. page 6 change description of functions and example of constant setting ?4)? equation of t blankouternal ?. page 7 change description of functions and example of constant setting ?4)? figure 12?. page 26 change thermal design.
datasheet d a t a s h e e t notice - rev.003 ? 2012 rohm co., ltd. all rights reserved. notice general precaution 1) before you use our products, you are requested to care fully read this document and fully understand its contents. rohm shall not be in any way responsible or liable for fa ilure, malfunction or accident arising from the use of any rohm?s products against warning, caution or note contained in this document. 2) all information contained in this document is current as of the issuing date and subjec t to change without any prior notice. before purchasing or using rohm?s products, please confirm the la test information with a rohm sales representative. precaution on using rohm products 1) our products are designed and manufactured for applicat ion in ordinary electronic equipments (such as av equipment, oa equipment, telecommunication equipment, home electroni c appliances, amusement equipment, etc.). if you intend to use our products in devices requiring extremel y high reliability (such as medical equipment, transport equipment, traffic equipment, aircraft/spacecra ft, nuclear power controllers, fuel c ontrollers, car equipment including car accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property (?specific applications?), please consult with the rohm sale s representative in advance. unless otherwise agreed in writing by rohm in advance, ro hm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any ro hm?s products for specific applications. 2) rohm designs and manufactures its products subject to strict quality control system. however, semiconductor products can fail or malfunction at a certain rate. please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe desi gn against the physical injury, damage to any property, which a failure or malfunction of our products may cause. the following are examples of safety measures: [a] installation of protection circuits or other protective devices to improve system safety [b] installation of redundant circuits to reduce the impact of single or multiple circuit failure 3) our products are designed and manufactured for use under standard conditions and not under any special or extraordinary environments or conditio ns, as exemplified below. accordin gly, rohm shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of an y rohm?s products under any special or extraordinary environments or conditions. if you intend to use our products under any special or extraordinary environments or conditions (as exemplified bel ow), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] use of our products in any types of liquid, incl uding water, oils, chemicals, and organic solvents [b] use of our products outdoors or in places where the products are exposed to direct sunlight or dust [c] use of our products in places where the products ar e exposed to sea wind or corrosive gases, including cl 2 , h 2 s, nh 3 , so 2 , and no 2 [d] use of our products in places where the products are exposed to static electricity or electromagnetic waves [e] use of our products in proximity to heat-producing components, plastic cords, or other flammable items [f] sealing or coating our products with resin or other coating materials [g] use of our products without cleaning residue of flux (ev en if you use no-clean type fluxes, cleaning residue of flux is recommended); or washing our products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] use of the products in places subject to dew condensation 4) the products are not subjec t to radiation-proof design. 5) please verify and confirm characteristics of the final or mounted products in using the products. 6) in particular, if a transient load (a large amount of load applied in a short per iod of time, such as pulse) is applied, confirmation of performance characteristics after on-boar d mounting is strongly recomm ended. avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading c ondition may negatively affect product performance and reliability. 7) de-rate power dissipation (pd) depending on ambient temper ature (ta). when used in seal ed area, confirm the actual ambient temperature. 8) confirm that operation temperature is within t he specified range described in the product specification. 9) rohm shall not be in any way responsible or liable for fa ilure induced under deviant condi tion from what is defined in this document.
datasheet d a t a s h e e t notice - rev.003 ? 2012 rohm co., ltd. all rights reserved. precaution for mounting / circuit board design 1) when a highly active halogenous (chlori ne, bromine, etc.) flux is used, the resi due of flux may negatively affect product performance and reliability. 2) in principle, the reflow soldering method must be used; if flow soldering method is preferred, please consult with the rohm representative in advance. for details, please refer to rohm mounting specification precautions regarding application examples and external circuits 1) if change is made to the constant of an external circuit, pl ease allow a sufficient margin c onsidering variations of the characteristics of the products and external components, including transient characteri stics, as well as static characteristics. 2) you agree that application notes, re ference designs, and associated data and in formation contained in this document are presented only as guidance for products use. theref ore, in case you use such information, you are solely responsible for it and you must exercise your own indepen dent verification and judgment in the use of such information contained in this document. rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. precaution for electrostatic this product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. please take proper caution in your manufacturing process and storage so that voltage exceeding t he products maximum rating will not be applied to products. please take special care under dry condit ion (e.g. grounding of human body / equipment / solder iron, isolation from charged objects, se tting of ionizer, friction prevention and temperature / humidity control). precaution for storage / transportation 1) product performance and soldered connections may deteriora te if the products are stor ed in the places where: [a] the products are exposed to sea winds or corros ive gases, including cl2, h2s, nh3, so2, and no2 [b] the temperature or humidity exceeds those recommended by rohm [c] the products are exposed to di rect sunshine or condensation [d] the products are exposed to high electrostatic 2) even under rohm recommended storage c ondition, solderability of products out of recommended storage time period may be degraded. it is strongly recommended to confirm sol derability before using products of which storage time is exceeding the recommended storage time period. 3) store / transport cartons in the co rrect direction, which is indicated on a carton with a symbol. otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4) use products within the specified time after opening a hum idity barrier bag. baking is required before using products of which storage time is exceeding the recommended storage time period. precaution for product label qr code printed on rohm products label is for rohm?s internal use only. precaution for disposition when disposing products please dispose them proper ly using an authorized industry waste company. precaution for foreign exchange and foreign trade act since our products might fall under cont rolled goods prescribed by the applicable foreign exchange and foreign trade act, please consult with rohm representative in case of export. precaution regarding intellectual property rights 1) all information and data including but not limited to application example contain ed in this document is for reference only. rohm does not warrant that foregoi ng information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. rohm shall not be in any way responsible or liable for infringement of any intellectual property rights or ot her damages arising from use of such information or data.: 2) no license, expressly or implied, is granted hereby under any intellectual property rights or other rights of rohm or any third parties with respect to the information contained in this document.
datasheet d a t a s h e e t notice - rev.003 ? 2012 rohm co., ltd. all rights reserved. other precaution 1) the information contained in this document is provi ded on an ?as is? basis and rohm does not warrant that all information contained in this document is accurate and/or error-free. rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties resulting from inaccuracy or errors of or concerning such information. 2) this document may not be reprinted or reproduced, in whol e or in part, without prior written consent of rohm. 3) the products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of rohm. 4) in no event shall you use in any way whatsoever the pr oducts and the related technical information contained in the products or this document for any military purposes, incl uding but not limited to, the development of mass-destruction weapons. 5) the proper names of companies or products described in this document are trademarks or registered trademarks of rohm, its affiliated companies or third parties.

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